Anly Electronics heat sink HS-081-150 for solid state relay *new*

A heat sink in computers is a passive cooling device that absorbs and dissipates heat generated by electronic components, such as processors (CPUs) or graphics processing units (GPUs). The primary purpose of a heat sink is to keep these components within their safe operating temperature range to prevent overheating, which can lead to reduced performance or even permanent damage. The heat sink works through a process of thermal conduction and convection. It typically consists of a metal (commonly aluminum or copper) structure with fins or ridges to increase its surface area. The electronic component, such as a CPU, is in direct contact with the base of the heat sink, and as it generates heat during operation, the heat is conducted through the metal structure.

Commonly it is advisable to put some thermally conductive grease (or other similar substance) between heat sink and the part requiring cooling.

Heat sink technical details:

• Colour:
  • Golden
• Material:
  • Aluminium anodised with gold color
• Semiconductor mounting:
  • 2x M4 screws which are spaced 47.5mm apart
• Compatible fan size:
  • 80x80mm
• Fan screw's mounting pitch:
  • 71.5mm
  • One side has 10mm deep M4 threads. Other end has just 3,35mm in diameter profile's mounting slots
• Flange mounting holes:
  • 6x9mm notches spaced 100mm apart
• Compatible with solid state relays with maximum current of:
  • 60A
  • 70A
  • 75A
  • 80A
  • 90A
  • 100A

Download Anly Electronics heat sinks technical datasheet